FlexTech Alliance, focused on developing the
electronic display and flexible, printed electronics industry supply chains,
announced the completion of a research project with Clemson University for
benchmarking printing processes in roll-to-roll manufacturing of printed electronics
components. The FlexTech Alliance funded study is an important first step in
understanding conductive printed features fabricated using full-scale printing
presses as opposed to laboratory scale equipment.
The study, performed at the Sonoco Institute
of Packaging Design and Graphics at Clemson University, yielded a number of
insights into the performance of flexographically printed conductive features.
A variety of factors were investigated including plate type and preparation
conditions, plate tint and patterning, press speed, substrate type, printed
feature size, press orientation, and line and gap width. The printed traces
were evaluated by electrical and optical measurements. Over 45,000 resistances
were measured, and nearly 1,000 three-dimensional optical profiles were
obtained.
“The biggest roadblock in completing all of
the press trials was obtaining the volume of conductive inks required to
conduct the benchmarking,” commented Charles Tonkin, director of the Sonoco
Institute of Packaging Design and Graphics at Clemson University. “However, we
made tremendous progress in understanding the variables of anilox cell volume
and its impact on conductivity, the printed feature performance of different
substrate materials, the impact of orientation of the printed features relative
to the press direction, and the inconsistencies between plate type and
associated factors.”
“The benchmarks established by the Clemson
University study significantly moves us along the path to commercialization,”
said Michael Ciesinski, CEO of the FlexTech Alliance. “The study provides
knowledge of critical factors influencing process variability for printed,
flexible electronics. We’re now evaluating next steps to further the work
Clemson has initiated.”
Full results of the study were made available
to FlexTech Alliance members.
Clemson dedicated the Sonoco Institute of
Packaging Design and Graphics in March 2009. It is the only university program
in the country that brings together packaging science, graphic communication,
and the materials, environmental science, manufacturing, marketing and
psychology disciplines to study packaging methods.
