BDT Media Automation GmbH, a market leader
for B2 format feeders in digital printing, FujiFilm Dimatix, Inc., one of
world’s leading providers of inkjet printheads for commercial and industrial
printing, and Phoseon Technology, a leader in UV LED curing solutions for
commercial and industrial applications have agreed to work together to develop
a complete digital printing solution for packaging applications. The system
will take ad-vantage of the flexibility of the BDT Tornado media handling
technology and the versatility of UV printing provided by Fuji-Dimatix and
Phoseon. The first demonstration of the solution will be at the Pack Expo
International in Chicago, Nov. 2-5, 2014.
The Tornado-based Product Feeder (TPF) and
Print-system will be able to perform off-line pro-cessing of standard packaging
materials including coated and uncoated cardboard, corrugated board, and paper
stock, as well as more exotic packing materials such as metallic foils and
plastics. The solution will feed, align, print, cure and stack – all with
minimal user intervention and greatly shortened job set up times.
“We are very pleased to be cooperating with
Fuji Dimatix and Phoseon, two market leaders in their respective fields, to
bring the TPF system to market. This development will bring the best of
material handling and UV digital printing to package manufacturers”, said Ralf
Hipp, Vice President of Print Media Handling at BDT. “Our goal is to enable
higher shop profitability by en-abling our customers to achieve unprecedented
packaging job flexibility.”
“FujiFilm Dimatix is the world’s leading
supplier of piezoelectric drop-on-demand ink jet products for industrial
applications,” said Howard Baldwin, Vice President of Sales at FujiFilm. “The
synergy of material handling, printing and LED curing together will deliver an
optimal industrial solu-tion for both end users and OEM’s.”
“Phoseon Technology is excited to support
BDT’s TPF system by providing leading-edge UV LED curing capability,” said Chad
Taggard, Vice President of Marketing at Phoseon. “The combination with Fuji
Dimatix and BDT showcases how industry leaders can work together to enable
customers higher productivity solutions with improved quality.”
The TPF system can be seen at the Pack Expo
International in Chicago at the BDT booth – E-9705 in Lakeside Lower Hall.
