The market for in-mold labeling and in-mold decoration is
growing, with interesting future prospects.
Innovation, new materials, application development and market potential
provide the context for AWA Alexander Watson Associates’ annual conference and
exhibition. AWA IMLCON & IMDCON delivers
- for everyone in the value chain – a review of technology, markets, and
trends.
‘A “one-of-a-kind”
event’
AWA IMLCON & IMDCON 2015 takes place on February 18-19
2015 at the Sofitel Miami, Florida, USA.
Says Corey Reardon, President and CEO of AWA Alexander Watson
Associates: ‘It is a one-of-a-kind event
focused on the in-mold labeling and in-mold decorating market. It attracts
delegates and brand owners from around the world and is a must-attend industry
conference.’
Concurrent sessions
on IML/IMD
The 2015 event will feature two concurrent sessions
dedicated specifically to IML and IMD.
This will enable a more focused, in-depth discussion of the respective technologies
and applications. Thetwo concurrent
sessions complement the general conference and tabletop exhibition.
Speakers will represent the entire value chain, from technology
sectors such as die-cutting, MuCell technology, thermoforming and TRIM. The program also includes M&A and
consolidation activity within the global packaging and label industry, and
in-depth market data from AWA’s ongoing research.
AWA IMLCON & IMDCON 2015 is sponsored by
industry-leading companies including Berhalter AG, Illig Maschinenbau,
Precision Press, Inc, Taghleef Industries, and Yupo Corporation, and promises
excellent networking opportunities. Earlybird discounts on the registration fee
are offered till January 1, 2015. Full
program details, as well as online registration, are available via the AWA
Alexander Watson Associates website, www.awa-bv.com.
